Shaanxi KeGu New Material Technology Co., Ltd
Shaanxi KeGu New Material Technology Co., Ltd
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Product Description
Hexagonal Boron Nitride (HBN) ceramics deliver exceptional thermal management and electrical insulation for demanding semiconductor manufacturing processes. With graphite-like structure but superior performance, our "white graphite" components maintain structural integrity in extreme temperatures while providing excellent heat dissipation - making them ideal for critical semiconductor equipment applications.
Key Technical Advantages & Performance Features
Superior Thermal Management: High thermal conductivity ensures efficient heat dissipation in extreme processing environments
Exceptional Temperature Resistance: Maintains structural integrity and performance stability at elevated temperatures exceeding 2000°C
Large Component Capability: Advanced hot pressing technology enables production of large-dimension components up to 650mm diameter
Enhanced Material Durability: Very low porosity structure provides superior chemical resistance against corrosive semiconductor processing environments
Precision Manufacturing Ready: Mohs hardness of 2 allows easy machining into complex geometries with minimal post-processing
Net Shape Production: Direct sintering capability reduces material waste and manufacturing costs
Primary Semiconductor Equipment Applications
Gas Distribution & Process Components
Gas distribution plates & spray nozzles
Top nozzles and baffle assemblies
Pedestal heaters & cover plates
High-Temperature Processing Components
RF windows & evaporation crucibles
Wafer processing components & rings
Heat resistant substrates & base materials
Why Choose Our Boron Nitride Ceramics?
Our HBN components are precision-engineered for reliability in the most demanding semiconductor fabrication environments. The unique combination of net-shape sintering capability, large diameter manufacturing (up to 650mm), and exceptional thermal properties makes them the optimal choice for:
High-temperature thermal management systems
Corrosive environment applications
Precision semiconductor manufacturing
Custom-shaped components requiring minimal post-processing
Search-Optimized Technical Highlights
Boron nitride ceramics for semiconductor equipment
HBN components with 650mm diameter capability
White graphite for high-temperature applications
Thermally conductive electrical insulators
Corrosion-resistant semiconductor components
